Equipment Technology Conveyance - Longhill Industries

Longhill

FULLY AUTO WAFER
MOUNTER MODEL LH860

World's Leading Supplier

FEATURES:

Air Bubbles Free Mounting

Minimal contact with wafer.

Vacuum mount, no roller

3" to 8" Wafer Capability

UV Tape Capability

High Accuracy in X-Y & Theta Rotation

ADDITIONAL FEATURES:

Manual Mode Operation: An additional set of switches and monitor is available for manual load mounting operation.

Partial Wafer Mounting: Partial wafer mounting can be done by manually loading wafer into mounting chamber with the help of spaces supporting the broken edges. No reprogramming or parameter setting is required.

Wafer Thickness: Wafer chuck is designed in such a way that it can handle thickness of 4 mil to 50 mil without any conversion or adjustment.

Wafer Orientation: Robot arm can be programmed such that wafer is placed at 0, 90, 180, or 270 degrees with reference to frame.

UV Tape Capability: Machine includes a liner tape rewind assembly to handle UV tape.

ESD Protection: Two ionizers are positioned beneath the adhesive tape and above the mounting chamber to remove any static charge generated.

Vacuum Supply:Integrated vacuum pump is standard on machine. No need for the vacuum facilities.

Machine Safety: Doors are interlocked with EMO.

Wafer/Frame ID System (Optional): An optical character recognition system for wafer and bar code reader for frame are available per custom specification.

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Phone: (408) 496-0686

	Air Bubbles Free Mounting
	Minimal contact with wafer.
	Vacuum mount, no roller
	3" to 8" Wafer Capability
	UV Tape Capability
	High Accuracy in X-Y & Theta Rotation

	Manual Mode Operation: An additional set of switches and monitor is available for manual load mounting operation.
	Partial Wafer Mounting: Partial wafer mounting can be done by manually loading wafer into mounting chamber with the help of spaces supporting the broken edges. No reprogramming or parameter setting is required.
	Wafer Thickness: Wafer chuck is designed in such a way that it can handle thickness of 4 mil to 50 mil without any conversion or adjustment.
	Wafer Orientation: Robot arm can be programmed such that wafer is placed at 0, 90, 180, or 270 degrees with reference to frame.
	UV Tape Capability: Machine includes a liner tape rewind assembly to handle UV tape.
	ESD Protection: Two ionizers are positioned beneath the adhesive tape and above the mounting chamber to remove any static charge generated.
	Vacuum Supply:Integrated vacuum pump is standard on machine. No need for the vacuum facilities.
	Machine Safety: Doors are interlocked with EMO.
	Wafer/Frame ID System (Optional): An optical character recognition system for wafer and bar code reader for frame are available per custom specification.