Model LH838 Back Grind Tape De-Taper from Longhill Industries, Ltd., remover tape is applied onto the back grinding tape by a floating roller to minimize wafer stress. The uniquely designed peeling mechanism can accommodate very thin wafers.

Wafer input by cassette or coin stack wafer box. Non contact wafer centering with flat or notch finder.

Options:

• UV irradiator for UV release tape
• Bernoulli robotics for very thin wafers
• Double side de-taping in single pass