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| Air Bubbles Free Mounting | |
| Minimal Contact with Wafer. | |
| Vacuum Mount, No Roller | |
| 3" to 8" Wafer Capability | |
| UV Tape Capability. | |
| High Accuracy in X-Y & Theta Rotation |
| Wafer/tape is mounted inside a vacuum chamber. Nothing touches wafer except tape and edge support. | |
| No roller required. No more difficult alignment of roller/wafer parallelism, roller cleaning, and no pressure variation on wafer due to different thickness. | |
| Absolutely no air bubble and better adhesion. | |
| Tape tension is controlled and programmable. | |
| Quick change wafer chuck. |


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